PLM（Polycrystalline-like Diamond）

Characteristics

Patented product, PLM has the features of polycrystalline diamond, with higher material removal rate and better surface finish performance.
* Excellent self-sharpening ability, continuously generates new edges during interacting with the workpiece.
* Less lapping pressure needed during work.
* Less residual debris left on the workpiece.
* Without limit of large sizes and volume quantity supply.
* Lower cost. 

Applications:

* Neutral and clean, suitable for producing polishing slurry and other liquid polishing products. 
* Mainly used for fine lapping and polishing on semiconductor industry ( sapphire, Si, SiC, GaN), electronic and IT industries, etc.
* Also recommended for fast grinding and high request on the surface roughness on hard & brittle materials.